Pouya Asrar
Pouya Asrar - Advanced Packaging and Thermal Engineering Leader
Pouya Asrar is an advanced packaging specialist and thermal engineer with 15+ years of experience in microelectronics, semiconductor technologies, and thermal management. Based in San Jose, California, Pouya Asrar combines technical expertise with customer engagement and program leadership to help translate complex engineering solutions into practical business outcomes.
As a senior manager on Samsung’s advanced packaging team, Pouya Asrar presented packaging solutions to customers and coordinated engagements from initial business discussions through ongoing execution. He worked closely with sales and engineering teams to support technical evaluations, resolve issues, and align customer requirements with engineering capabilities.
At Amazon, Pouya Asrar served as an applied thermal scientist on Alexa smart home devices and oversaw thermal design, simulation, testing, and validation at both the device and chip levels. He also gained hands-on experience evaluating electronic components during an internship with Tesla’s infotainment team.
Pouya Asrar earned a PhD in Mechanical Engineering from the Georgia Institute of Technology, where he researched microfluidic cooling devices and two-phase heat transfer. He also earned a master’s degree in Mechanical Engineering from Iowa State University and a bachelor’s degree from Sharif University of Technology. His technical capabilities include computational fluid dynamics, mechanical design, experimental validation, and thermal characterization. He has worked with engineering tools such as ANSYS Icepak, Flotherm XT, COMSOL, SolidWorks, MATLAB, and Python.
Recognized for his research contributions, Pouya Asrar received the Best Presentation Award at an IMAPS conference in 2017. His work has also appeared in Electronic Cooling Magazine and at IEEE technical conferences, reflecting his continued contributions to thermal engineering and advanced electronics packaging.
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San Jose, CA US